Probe Card Analyzer

We offer tools employing the latest technology and innovation which we consistently evaluate to ensure our customers have access to the fastest and most easy-to-use equipment in the industry. BE Precision Technology is dedicated to serving the probe-card manufacturer and end-user markets alike. Our systems are superior in accuracy and processing speed.

Description

We offer tools employing the latest technology and innovation which we consistently evaluate to ensure our customers have access to the fastest and most easy-to-use equipment in the industry. BE Precision Technology is dedicated to serving the probe-card manufacturer and end-user markets alike. Our systems are superior in accuracy and processing speed.

Supervisor IV has considerable measurement and analytical capabilities. The Supervisor IV is a probe-card verification system. Supervisor IV ensures the integrity of probe-card assemblies and verifies they are ready for testing. SPC characterization before and after wafer sort will also allow the analysis of probe-card performance characteristics and facilitate correlation to test yield.

Inspector has considerable measurement and analytical capability, the tool has been designed from the beginning to serve as a verification and investigation system. Its primary purpose is to ensure the integrity of probe- card assemblies and verify that the probe-card is ready and can safely be used for testing.
In addition to alignment and planarity, the system can measure contact resistance (including ultra-low resistance) and compare the results against the stored reference data file. Probe tips can be cleaned or sanded with the MANAGER IV to allow for a retest of contact resistance. Manager IV has two user-selectable leakage test modes, the first to check leakage to adjacent probes and the second to check leakage to all tested probes. Bussed probes on a probe card can be analyzed with the installed option in the system. Up to 12,000 channels can be checked. MANAGER IV offers two options to check contact force (gram force). One measures all probes in one movement and calculates the average value, the other measures each individual probe’s linearity, gram force, and spring rate.
Today more complex probe cards are being used. More pins, higher density, and larger arrays require a new approach in probe-card analysis. With the soaring cost of next-generation probe cards, repair of defective cards becomes a necessity. We offer all capabilities with the new MANAGER V. Future proof, up to 450 mm full wafer contact probe-cards can be analyzed with up to 88,000 test channels. High-end materials are used to stand extra tough requirements—such as a 500 mm diameter diamond viewing window, an ultra-stiff carbon flip-table, and a high power Z–stage to generate 600 Kg of contact force.

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